Electronic product packaging structure

Application (Patent) No.: CN200420121113.9 Filing date: 2004.12.31 Name: Packaging structure of electronic products is disclosed (announcement) No.: CN2771128 Publication (publication) day: 2006.04.12 Main classification number: B65D81/05 (2006.01) I points Case Original Application No.: Class No. B65D81/05(2006.01)I;B65D85/30(2006.01)I Date of Issuance: Priority: Application (patent) Person: Inventec Co., Ltd. Address: Invention in Taipei, Taiwan (Designer): Qiu Quancheng; Chen Lijun International Application: International Announcement: Date of Entry into the Country: Patent Agency: Beijing Jikai Intellectual Property Agency Co., Ltd. Agent: Cheng Wei Abstract A packaging structure of electronic products mainly includes: Two shock-absorbing buffers The bodies are spaced apart from each other and respectively provided with a plurality of first positioning portions and a pressure resistant body, and a plurality of second positioning portions corresponding to the first positioning portions are provided, and the second positioning portions are coupled to the first coupling portions. The pressure-resistant body is combined with the shock-absorbing buffer body; therefore, the packaging structure of the electronic product of the present invention may be Each part of the electronic product after mounting provides shockproof, buffer and pressure protection, which can reduce the cost of packaging. At the same time, because the packaging structure of the electronic product of the utility model does not require the use of additional bonding components or tools, the production speed can be improved. Reduce costs even more. In addition, the utility model can be applied to electronic products with different shapes and structures, can improve the flexibility of package design, and further improve the industrial use value. Sovereignty item 1. A packaging structure of an electronic product, characterized in that the packaging structure mainly comprises: two shock-absorbing buffer bodies spaced apart from each other and provided with a plurality of first positioning portions respectively; and a pressure-resistant body provided with Corresponding to the plurality of second positioning portions of the first positioning portion, the second positioning portion is coupled to the first coupling portion, and the pressure-resistant body is coupled to the shock-absorbing buffer.