Multi-layer polymer film for packaging furnace-processed foods

【Patent Type】 Invention Patent 【Patent Name】 Multi-layer polymer film for packaging oven-processed food 【Applicant】 Dupont Taijin Film Partner Co., Ltd. [Inventor] M.E. Davis [Main Application] Address】 United States Delaware [application number] 02818684.2
【 Application Date 】 2002.09.23
[Verification notice number] 1558827
【 Validation announcement date 】 2004.12.29
【 Main classification number 】 B32B27/36
[Category] B32B27/36 B65D77/20 B65D65/40
Sovereignty Item 1. A heat-sealable, peelable multilayer laminated polymer film comprising a polymeric substrate layer, one or two intermediate layers, and one or more layers of conductive material. The polymer substrate layer has a heat sealable peelable polymer layer on one side and a shrinkable polymer layer on the opposite side, wherein the shrinkable layer is at 55-100°C. The degree of shrinkage in the first dimension is about 10-80%, the ratio of the degree of shrinkage in the first dimension at 100° C. relative to the second orthogonal dimension is 1:1 to 10:1, and the intermediate layer is located Between the substrate layer and the shrinkable layer and/or between the substrate layer and the heat sealable peelable layer.
[Instruction CD-ROM] D0452
[Abstract] The present invention relates to a heat sealable peelable multilayer laminated polymer film comprising a polymeric substrate layer, one or two intermediate layers and one or more layers of conductive material. The polymer substrate layer has a heat sealable peelable polymer layer on one side and a shrinkable polymer layer on the opposite side, wherein the shrinkable layer is at 55-100°C. The degree of shrinkage in the first dimension is about 10-80%, the ratio of the degree of shrinkage in the first dimension at 100° C. relative to the second orthogonal dimension is 1:1 to 10:1, and the intermediate layer is located Between the substrate layer and the shrinkable layer and/or between the substrate layer and the heat sealable peelable layer; and relating to the use of the film as or for providing a package for a furnace-processable food product or in a furnace process The use of a heat sealable lid on a container, wherein the packaging material is self-peeling and self-venting during a cooking cycle.
【 Agency 】 China Patent Agent (Hong Kong) Co., Ltd. [Proxy] Zhao Sulin; Duan Xiaoling